Simulation of microstrip structures on LTCC substrates

We have computed dispersion of microstrip transmission lines and resonant frequencies for microstrip resonators based on LTCC substrates, as functions of material and structural parameters. The analysis is done by formulating the electric field integral equations in spectral domain. Galerkin's technique is used to find numerical solutions. The experimental data generated on the dependence of permittivity on temperature is used for simulation. The method forms the basis of modeling and design of various multiplayer microwave architecture employing LTCC materials.

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International Conference on Advanced Materials and Composites

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